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» Are carbon nanotubes the future of VLSI interconnections
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CDES
2006
100views Hardware» more  CDES 2006»
13 years 6 months ago
Integrity and Integration Issues for Nano-Tube Based Interconnect Systems
: As we continue miniaturization of circuits into nano-scale, interconnects have been recognized as the limiting factor for next generation of computing structures. To increase the...
Tulin Mangir
DAC
2007
ACM
13 years 8 months ago
CAD Implications of New Interconnect Technologies
This paper looks at the CAD implications of possible new interconnect technologies. We consider three technologies in particular: three dimensional ICs, carbon nanotubes as a repl...
Louis Scheffer
ICCAD
2007
IEEE
119views Hardware» more  ICCAD 2007»
13 years 6 months ago
IntSim: A CAD tool for optimization of multilevel interconnect networks
– Interconnect issues are becoming increasingly important for ULSI systems. IntSim, an interconnect CAD tool, has been developed to obtain pitches of different wiring levels and ...
Deepak C. Sekar, Azad Naeemi, Reza Sarvari, Jeffre...