Sciweavers

5 search results - page 1 / 1
» Assessing the Implications of Process Variations on Future C...
Sort
View
ISVLSI
2007
IEEE
116views VLSI» more  ISVLSI 2007»
13 years 11 months ago
Impact of Process Variations on Carbon Nanotube Bundle Interconnect for Future FPGA Architectures
As CMOS technology continues to scale, copper interconnect (CuI) will hinder the performance and reliability of Field Programmable Gate Arrays (FPGA) motivating the need for alter...
Soumya Eachempati, Narayanan Vijaykrishnan, Arthur...
ASPDAC
2007
ACM
122views Hardware» more  ASPDAC 2007»
13 years 8 months ago
Predicting the Performance and Reliability of Carbon Nanotube Bundles for On-Chip Interconnect
Single-walled carbon nanotube (SWCNT) bundles have the potential to provide an attractive solution for the resistivity and electromigration problems faced by traditional copper int...
Arthur Nieuwoudt, Mosin Mondal, Yehia Massoud
DATE
2007
IEEE
150views Hardware» more  DATE 2007»
13 years 11 months ago
Assessing carbon nanotube bundle interconnect for future FPGA architectures
Field Programmable Gate Arrays (FPGAs) are important hardware platforms in various applications due to increasing design complexity and mask costs. However, as CMOS process techno...
Soumya Eachempati, Arthur Nieuwoudt, Aman Gayasen,...
SLIP
2009
ACM
13 years 11 months ago
Closed-form solution for timing analysis of process variations on SWCNT interconnect
In this paper, a comprehensive and fast method is presented for the timing analysis of process variations on single-walled carbon nanotube (SWCNT) bundles. Unlike previous works t...
Peng Sun, Rong Luo