44 search results - page 1 / 9 » CAD challenges for 3D ICs |
ASPDAC
2009
ACM
13 years 8 months ago
2009
ACM
31
Voted
DAC
2011
ACM
12 years 4 months ago
2011
ACM
Existing thermal-aware 3D placement methods assume that the temperature of 3D ICs can be optimized by properly distributing the power dissipations, and ignoring the heat conductiv...
SLIP
2009
ACM
13 years 11 months ago
2009
ACM
Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
ISQED
2007
IEEE
13 years 11 months ago
2007
IEEE
Due to the roaring power dissipation and gaining popularity of 3D integration, thermal dissipation has been a critical concern of modern VLSI design. The availability for chip-lev...
VRML
2003
ACM
13 years 9 months ago
2003
ACM
One of the major challenges in Computer Graphics concerns the 3D representation and physically-based simulation of garments. In our research, we are working closely with the texti...