44 search results - page 4 / 9 » CAD challenges for 3D ICs |
ICCAD
2009
IEEE
13 years 3 months ago
2009
IEEE
Pre-bond testing of 3D stacked ICs involves testing individual dies before bonding. The overall yield of 3D ICs improves with prebond testability because designers can avoid stack...
ICCAD
2005
IEEE
14 years 3 months ago
2005
IEEE
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
GLVLSI
2006
IEEE
14 years 5 days ago
2006
IEEE
In modern IC design, the number of long on-chip wires has been growing rapidly because of the increasing circuit complexity. Interconnect delay has dominated over gate delay as te...
DATE
2009
IEEE
14 years 26 days ago
2009
IEEE
Three-dimensional integrated circuits are a promising approach to address the integration challenges faced by current Systems on Chips (SoCs). Designing an efficient Network on C...
CVPR
2011
IEEE
12 years 9 months ago
2011
IEEE
3D object detection and importance regression/ranking are at the core for semantically interpreting 3D medical images of computer aided diagnosis (CAD). In this paper, we propose ...