18 search results - page 2 / 4 » Chip level thermal profile estimation using on-chip temperat... |
TCAD
2008
13 years 5 months ago
2008
The nonuniform substrate thermal profile and process variations are two major concerns in the present-day ultradeep submicrometer designs. To correctly predict performance/ leakage...
ICCD
2005
IEEE
13 years 11 months ago
2005
IEEE
As power density increases exponentially, run-time regulation of operating temperature by dynamic thermal management becomes imperative. This paper proposes a novel approach to re...
ASPDAC
2008
ACM
13 years 7 months ago
2008
ACM
At system level, the on-chip temperature depends both on power density and the thermal coupling with the neighboring regions. The problem of finding the right set of input power pr...
ASPDAC
2008
ACM
13 years 7 months ago
2008
ACM
- With the increasing levels of variability in the behavior of manufactured nano-scale devices and dramatic changes in the power density on a chip, timely identification of hot spo...
ICCD
2005
IEEE
14 years 2 months ago
2005
IEEE
FPGA logic densities continue to increase at a tremendous rate. This has had the undesired consequence of increased power density, which manifests itself as higher ondie temperatu...