Abstract-- Preventing silicon chips from negative, even disastrous thermal hazards has become increasingly challenging these days; considering thermal effects early in the design c...
Wei Huang, Karthik Sankaranarayanan, Kevin Skadron...
With power density and hence cooling costs rising exponentially, processor packaging can no longer be designed for the worst case, and there is an urgent need for runtime processo...
Kevin Skadron, Mircea R. Stan, Wei Huang, Sivakuma...
This paper studies microprocessor floorplanning considering thermal and throughput optimization. We first develop a stochastic heat diffusion model taking into account the appl...
Thermal design in sub-100nm technologies is one of the major challenges to the CAD community. In this paper, we first introduce the idea of temperature-aware design. We then propo...
Wei Huang, Mircea R. Stan, Kevin Skadron, Karthik ...
: With technology scaling, elevated temperatures caused by increased power density create a critical bottleneck modulating the circuit operation. With the advent of FinFET technolo...