67 search results - page 5 / 14 » Cool MPSoC programming |
CODES
2007
IEEE
13 years 11 months ago
2007
IEEE
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
TVLSI
2008
13 years 4 months ago
2008
Thermal hot spots and high temperature gradients degrade reliability and performance, and increase cooling costs and leakage power. In this paper, we explore the benefits of temper...
FPL
2007
Springer
13 years 11 months ago
2007
Springer
Multiprocessor systems-on-chip (MPSoC) are being developed in increasing numbers to support the high number of applications running on modern embedded systems. Designing and progr...
GLVLSI
2007
IEEE
13 years 11 months ago
2007
IEEE
Multi-Processor System-On-Chip (MPSoC) can provide the performance levels required by high-end embedded applications. However, they do so at the price of an increasing power densi...
CCE
2008
13 years 5 months ago
2008
This paper presents a technique for simultaneous targeting and design in cooling water systems comprising of at least two cooling towers and several cooling water using operations...