38 search results - page 1 / 8 » Design and Management of 3D Chip Multiprocessors Using Netwo... |
ISCA
2006
IEEE
13 years 11 months ago
2006
IEEE
Long interconnects are becoming an increasingly important problem from both power and performance perspectives. This motivates designers to adopt on-chip network-based communicati...
MJ
2011
12 years 11 months ago
2011
New tendencies envisage 2D/3D Multi-Processor System-On-Chip (MPSoC) as a promising solution for the consumer electronics market. MPSoCs are complex to design, as they must execute...
TCAD
2008
13 years 4 months ago
2008
Three-dimensional integration has the potential to improve the communication latency and integration density of chip-level multiprocessors (CMPs). However, the stacked highpower de...
BIRTHDAY
2012
Springer
12 years 18 days ago
2012
Springer
3-D integration presents many new opportunities for architects and embedded systems designers. However, 3-D integration has not yet been explored by the cryptographic hardware com...
SAC
2006
ACM
13 years 10 months ago
2006
ACM
The reduction of image reconstruction time is needed to spread the use of PET for research and routine clinical practice. In this purpose, this article presents a hardware/softwar...