Thermal hot spots and high temperature gradients degrade reliability and performance, and increase cooling costs and leakage power. In this paper, we explore the benefits of temper...
Ayse Kivilcim Coskun, T. T. Rosing, Keith Whisnant...
Thermal management is critical for clusters because of the increasing power consumption of modern processors, compact server architectures and growing server density in data center...
It is known that temperature gradients and thermal hotspots affect the reliability of microprocessors. Temperature is also an important constraint when maximizing the performance...
Vinay Hanumaiah, Ravishankar Rao, Sarma B. K. Vrud...
We study the problem of scheduling repetitive real-time tasks with the Earliest Deadline First (EDF) policy that can guarantee the given maximal temperature constraint. We show th...
A rising horizon in chip fabrication is the 3D integration technology. It stacks two or more dies vertically with a dense, high-speed interface to increase the device density and ...
Xiuyi Zhou, Yi Xu, Yu Du, Youtao Zhang, Jun Yang 0...