Exponentially rising cooling/packaging costs due to high power density call for architectural and software-level thermal management. Dynamic thermal management (DTM) techniques co...
In the past few years, Rapid Thermal Processes (RTP) have gained acceptance as mainstream technology for semi-conductors manufacturing. These processes are characterized by a sing...
Abstract--Thermal issues are fast becoming major design constraints in high-performance systems. Temperature variations adversely affect system reliability and prompt worst-case de...
Amit Kumar 0002, Li Shang, Li-Shiuan Peh, Niraj K....
This paper presents a new architecture for time-to-digital conversion enabling a time resolution of 17ps over a range of 50ns with a conversion rate of 20MS/s. The proposed archit...
— This paper discusses a joint decentralized clustering and ranging algorithm for wireless ad-hoc sensor networks. Each sensor uses a random waiting timer and local criteria to d...