30 search results - page 4 / 6 » Fast thermal simulation for architecture level dynamic therm... |
DAC
2008
ACM
14 years 7 months ago
2008
ACM
Achieving high performance under a peak temperature limit is a first-order concern for VLSI designers. This paper presents a new model of a thermally-managed system, where a stoch...
VLSID
2008
IEEE
14 years 6 months ago
2008
IEEE
Simultaneous Multi-Threading (SMT) processors are becoming popular because they exploit both instruction-level and threadlevel parallelism by issuing instructions from different t...
ICCAD
2009
IEEE
13 years 3 months ago
2009
IEEE
Multi-core processors have become an integral part of mainstream high performance computer systems. In parallel, exponentially increasing power density and packaging costs have ne...
DAC
2009
ACM
14 years 26 days ago
2009
ACM
With new technologies, temperature has become a major issue to be considered at system level design. Without taking temperature aspects into consideration, no approach to energy o...
MICRO
2005
IEEE
13 years 11 months ago
2005
IEEE
Various architectural power reduction techniques have been proposed for on-chip caches in the last decade. In this paper, we first show that these power reduction techniques can b...