Multi-core processors have become an integral part of mainstream high performance computer systems. In parallel, exponentially increasing power density and packaging costs have ne...
Exponentially rising cooling/packaging costs due to high power density call for architectural and software-level thermal management. Dynamic thermal management (DTM) techniques co...
New tendencies envisage 2D/3D Multi-Processor System-On-Chip (MPSoC) as a promising solution for the consumer electronics market. MPSoCs are complex to design, as they must execute...