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ICCAD
2009
IEEE
171views Hardware» more  ICCAD 2009»
13 years 2 months ago
A hybrid local-global approach for multi-core thermal management
Multi-core processors have become an integral part of mainstream high performance computer systems. In parallel, exponentially increasing power density and packaging costs have ne...
Ramkumar Jayaseelan, Tulika Mitra
DAC
2009
ACM
14 years 5 months ago
Dynamic thermal management via architectural adaptation
Exponentially rising cooling/packaging costs due to high power density call for architectural and software-level thermal management. Dynamic thermal management (DTM) techniques co...
Ramkumar Jayaseelan, Tulika Mitra
MJ
2011
288views Multimedia» more  MJ 2011»
12 years 11 months ago
Emulation-based transient thermal modeling of 2D/3D systems-on-chip with active cooling
New tendencies envisage 2D/3D Multi-Processor System-On-Chip (MPSoC) as a promising solution for the consumer electronics market. MPSoCs are complex to design, as they must execute...
Pablo Garcia Del Valle, David Atienza