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VLSID
2010
IEEE
202views VLSI» more  VLSID 2010»
13 years 3 months ago
Processor Architecture Design Using 3D Integration Technology
The emerging three-dimensional (3D) chip architectures, with their intrinsic capability of reducing the wire length, is one of the promising solutions to mitigate the interconnect...
Yuan Xie
ASPLOS
2012
ACM
12 years 17 days ago
Providing safe, user space access to fast, solid state disks
Emerging fast, non-volatile memories (e.g., phase change memories, spin-torque MRAMs, and the memristor) reduce storage access latencies by an order of magnitude compared to state...
Adrian M. Caulfield, Todor I. Mollov, Louis Alex E...
DAC
2006
ACM
14 years 5 months ago
A thermally-aware performance analysis of vertically integrated (3-D) processor-memory hierarchy
Three-dimensional (3-D) integrated circuits have emerged as promising candidates to overcome the interconnect bottlenecks of nanometer scale designs. While they offer several othe...
Gian Luca Loi, Banit Agrawal, Navin Srivastava, Sh...
DAC
2012
ACM
11 years 7 months ago
Cache revive: architecting volatile STT-RAM caches for enhanced performance in CMPs
Spin-Transfer Torque RAM (STT-RAM) is an emerging non-volatile memory (NVM) technology that has the potential to replace the conventional on-chip SRAM caches for designing a more ...
Adwait Jog, Asit K. Mishra, Cong Xu, Yuan Xie, Vij...
DAC
2004
ACM
14 years 5 months ago
Heterogeneous MP-SoC: the solution to energy-efficient signal processing
To meet conflicting flexibility, performance and cost constraints of demanding signal processing applications, future designs in this domain will contain an increasing number of a...
Tim Kogel, Heinrich Meyr