Heterogeneous multiprocessor system-on-chips (MPSoCs) which consist of cores with various power and performance characteristics can customize their configuration to achieve higher ...
Thermal hot spots and high temperature gradients degrade reliability and performance, and increase cooling costs and leakage power. In this paper, we explore the benefits of temper...
Ayse Kivilcim Coskun, T. T. Rosing, Keith Whisnant...
3D stacked circuits reduce communication delay in multicore system-on-chips (SoCs) and enable heterogeneous integration of cores, memories, sensors, and RF devices. However, vertic...
Mohamed M. Sabry, Ayse Kivilcim Coskun, David Atie...
This paper addresses the problem of mapping an application, which is highly dynamic in the future, onto a heterogeneous multiprocessor platform in an energy efficient way. A two-p...
Rudy Lauwereins, Chun Wong, Paul Marchal, Johan Vo...