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INTEGRATION
2008
96views more  INTEGRATION 2008»
13 years 5 months ago
Implementation of a thermal management unit for canceling temperature-dependent clock skew variations
Thermal gradients across the die are becoming increasingly prominent as we scale further down into the sub-nanometer regime. While temperature was never a primary concern, its non...
Ashutosh Chakraborty, Karthik Duraisami, Ashoka Vi...
TVLSI
2010
12 years 12 months ago
Variation-Aware System-Level Power Analysis
Abstract-- The operational characteristics of integrated circuits based on nanoscale semiconductor technology are expected to be increasingly affected by variations in the manufact...
Saumya Chandra, Kanishka Lahiri, Anand Raghunathan...
DATE
2007
IEEE
148views Hardware» more  DATE 2007»
13 years 11 months ago
Temperature aware task scheduling in MPSoCs
In deep submicron circuits, elevation in temperatures has brought new challenges in reliability, timing, performance, cooling costs and leakage power. Conventional thermal managem...
Ayse Kivilcim Coskun, Tajana Simunic Rosing, Keith...
ICCD
2007
IEEE
180views Hardware» more  ICCD 2007»
14 years 2 months ago
Improving the reliability of on-chip data caches under process variations
On-chip caches take a large portion of the chip area. They are much more vulnerable to parameter variation than smaller units. As leakage current becomes a significant component ...
Wei Wu, Sheldon X.-D. Tan, Jun Yang 0002, Shih-Lie...
ISQED
2007
IEEE
163views Hardware» more  ISQED 2007»
13 years 11 months ago
Variation Analysis of CAM Cells
Process related variations are considered a major concern in emerging sub-65nm technologies. In this paper, we investigate the impact of process variations on different types of c...
Amol Mupid, Madhu Mutyam, Narayanan Vijaykrishnan,...