248 search results - page 1 / 50 » Implementing Caches in a 3D Technology for High Performance ... |
ICCD
2005
IEEE
14 years 1 months ago
2005
IEEE
3D integration is an emergent technology that has the potential to greatly increase device density while simultaneously providing faster on-chip communication. 3D fabrication invo...
MICRO
2007
IEEE
13 years 11 months ago
2007
IEEE
Aggressive technology scaling over the years has helped improve processor performance but has caused a reduction in processor reliability. Shrinking transistor sizes and lower sup...
HPCA
2007
IEEE
14 years 5 months ago
2007
IEEE
3D integration technology greatly increases transistor density while providing faster on-chip communication. 3D implementations of processors can simultaneously provide both laten...
CF
2008
ACM
13 years 6 months ago
2008
ACM
The current methodology used in mass-market processor design is to create a single base microarchitecture (e.g., Intel's "Core"or AMD's"K8") that is ...
MICRO
2009
IEEE
13 years 11 months ago
2009
IEEE
Process variations in integrated circuits have significant impact on their performance, leakage and stability. This is particularly evident in large, regular and dense structures...