31 search results - page 2 / 7 » Improved interconnect sharing by identity operation insertio... |
ISCA
2006
IEEE
13 years 11 months ago
2006
IEEE
Improvements in semiconductor technology have made it possible to include multiple processor cores on a single die. Chip Multi-Processors (CMP) are an attractive choice for future...
TCAD
2010
13 years 8 days ago
2010
In recent years, structured application-specific integrated circuit (ASIC) design style has lessened the importance of mask cost. Multiple structured ASIC chip designs share the sa...
HPCA
2008
IEEE
14 years 6 months ago
2008
IEEE
Multiprocessor computer systems are currently widely used in commercial settings to run critical applications. These applications often operate on sensitive data such as customer ...
DAC
2005
ACM
14 years 6 months ago
2005
ACM
Since across-chip interconnect delays can exceed a clock cycle in nanometer technologies, it has become essential in high performance designs to add flip-flops on wires with multi...
ASPDAC
2007
ACM
13 years 9 months ago
2007
ACM
Abstract-- Nanometer VLSI systems demand robust clock distribution network design for increased process and operating condition variabilities. In this paper, we propose minimum clo...