Sciweavers

54 search results - page 2 / 11
» Interconnect design for deep submicron ICs
Sort
View
DAC
2001
ACM
14 years 6 months ago
Analysis of On-Chip Inductance Effects using a Novel Performance Optimization Methodology for Distributed RLC Interconnects
This work presents a new and computationally efficient performance optimization technique for distributed RLC interconnects based on a rigorous delay computation scheme. The new o...
Kaustav Banerjee, Amit Mehrotra
DAC
2001
ACM
14 years 6 months ago
A2BC: Adaptive Address Bus Coding for Low Power Deep Sub-Micron Designs
Due to larger buses (length, width) and deep sub-micron effects where coupling capacitances between bus lines are in the same order of magnitude as base capacitances, power consum...
Haris Lekatsas, Jörg Henkel
GLVLSI
2006
IEEE
165views VLSI» more  GLVLSI 2006»
13 years 11 months ago
Block alignment in 3D floorplan using layered TCG
In modern IC design, the number of long on-chip wires has been growing rapidly because of the increasing circuit complexity. Interconnect delay has dominated over gate delay as te...
Jill H. Y. Law, Evangeline F. Y. Young, Royce L. S...
ICCD
2004
IEEE
129views Hardware» more  ICCD 2004»
14 years 1 months ago
Cache Array Architecture Optimization at Deep Submicron Technologies
A cache access time model, PRACTICS (PRedictor of Access and Cycle TIme for Cache Stack), has been developed to optimize the memory array architecture for the minimum access and c...
Annie (Yujuan) Zeng, Kenneth Rose, Ronald J. Gutma...
ICCD
2005
IEEE
101views Hardware» more  ICCD 2005»
14 years 1 months ago
Three-Dimensional Cache Design Exploration Using 3DCacti
As technology scales, interconnects dominate the performance and power behavior of deep submicron designs. Three-dimensional integrated circuits (3D ICs) have been proposed as a w...
Yuh-Fang Tsai, Yuan Xie, Narayanan Vijaykrishnan, ...