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» Interconnect scaling implications for CAD
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DAC
2000
ACM
14 years 6 months ago
Multiple Si layer ICs: motivation, performance analysis, and design implications
Continuous scaling of VLSI circuits is reducing gate delays but rapidly increasing interconnect delays. Semiconductor Industry Association (SIA) roadmap predicts that, beyond the ...
Shukri J. Souri, Kaustav Banerjee, Amit Mehrotra, ...
TCAD
2002
99views more  TCAD 2002»
13 years 5 months ago
Analysis of on-chip inductance effects for distributed RLC interconnects
This paper introduces an accurate analysis of on-chip inductance effects for distributed interconnects that takes the effect of both the series resistance and the output parasitic ...
Kaustav Banerjee, Amit Mehrotra
DAC
2001
ACM
14 years 6 months ago
Analysis of On-Chip Inductance Effects using a Novel Performance Optimization Methodology for Distributed RLC Interconnects
This work presents a new and computationally efficient performance optimization technique for distributed RLC interconnects based on a rigorous delay computation scheme. The new o...
Kaustav Banerjee, Amit Mehrotra
ISCA
2008
IEEE
130views Hardware» more  ISCA 2008»
13 years 11 months ago
Corona: System Implications of Emerging Nanophotonic Technology
We expect that many-core microprocessors will push performance per chip from the 10 gigaflop to the 10 teraflop range in the coming decade. To support this increased performance...
Dana Vantrease, Robert Schreiber, Matteo Monchiero...
IPPS
2008
IEEE
13 years 11 months ago
Exploiting spatial parallelism in Ethernet-based cluster interconnects
In this work we examine the implications of building a single logical link out of multiple physical links. We use MultiEdge [12] to examine the throughput-CPU utilization tradeoff...
Stavros Passas, George Kotsis, Sven Karlsson, Ange...