2 search results - page 1 / 1 » LP based white space redistribution for thermal via planning... |
ASPDAC
2008
ACM
13 years 7 months ago
2008
ACM
: Thermal issue is a critical challenge in 3D IC circuit design. Incorporating thermal vias into 3D IC is a promising way to mitigate thermal issues by lowering down the thermal re...
ICCAD
2007
IEEE
14 years 2 months ago
2007
IEEE
Abstract— Thermal issues are a primary concern in the threedimensional (3D) integrated circuit (IC) design. Temperature, area, and wire length must be simultaneously optimized du...