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ICPP
2007
IEEE
13 years 11 months ago
Tightly-Coupled Multi-Layer Topologies for 3-D NoCs
Three-dimensional Network-on-Chip (3-D NoC) is an emerging research topic exploring the network architecture of 3-D ICs that stack several smaller wafers for reducing wire length ...
Hiroki Matsutani, Michihiro Koibuchi, Hideharu Ama...
GLOBECOM
2006
IEEE
13 years 10 months ago
Scalable Layer-2/Layer-3 Multistage Switching Architectures for Software Routers
Abstract— Software routers are becoming an important alternative to proprietary and expensive network devices, because they exploit the economy of scale of the PC market and open...
Andrea Bianco, Jorge M. Finochietto, Giulio Galant...
DATE
2003
IEEE
99views Hardware» more  DATE 2003»
13 years 10 months ago
Load Distribution with the Proximity Congestion Awareness in a Network on Chip
In Networks on Chip, NoC, very low cost and high performance switches will be of critical importance. For a regular two-dimensional NoC we propose a very simple, memoryless switch...
Erland Nilsson, Mikael Millberg, Johnny Öberg...
DATE
2008
IEEE
109views Hardware» more  DATE 2008»
13 years 11 months ago
Layout-Aware, IR-Drop Tolerant Transition Fault Pattern Generation
— Market and customer demands have continued to push the limits of CMOS performance. At-speed test has become a common method to ensure these high performance chips are being shi...
Jeremy Lee, Sumit Narayan, Mike Kapralos, Mohammad...
TCAD
2010
105views more  TCAD 2010»
12 years 11 months ago
Fault Tolerant Network on Chip Switching With Graceful Performance Degradation
The structural redundancy inherent to on-chip interconnection networks [networks on chip (NoC)] can be exploited by adaptive routing algorithms in order to provide connectivity eve...
Adán Kohler, Gert Schley, Martin Radetzki