8 search results - page 1 / 2 » Leakage power dependent temperature estimation to predict th... |
ICCAD
2006
IEEE
14 years 1 months ago
2006
IEEE
In this work we propose a methodology to self-consistently solve leakage power with temperature to predict thermal runaway. We target 28nm FinFET based circuits as they are more p...
ASPDAC
2006
ACM
13 years 10 months ago
2006
ACM
: With technology scaling, elevated temperatures caused by increased power density create a critical bottleneck modulating the circuit operation. With the advent of FinFET technolo...
DATE
2007
IEEE
13 years 11 months ago
2007
IEEE
— It has been the conventional assumption that, due to the superlinear dependence of leakage power consumption on temperature, and widely varying on-chip temperature profiles, a...
TCAD
2008
13 years 4 months ago
2008
The nonuniform substrate thermal profile and process variations are two major concerns in the present-day ultradeep submicrometer designs. To correctly predict performance/ leakage...
ISLPED
2003
ACM
13 years 10 months ago
2003
ACM
Power dissipation is unevenly distributed in modern microprocessors leading to localized hot spots with significantly greater die temperature than surrounding cooler regions. Exc...