33 search results - page 2 / 7 » Leveraging 3D Technology for Improved Reliability |
ICCAD
2009
IEEE
13 years 2 months ago
2009
IEEE
Heat removal and power delivery have become two major reliability concerns in 3D stacked IC technology. For thermal problem, two possible solutions exist: thermal-through-silicon-...
AVSS
2007
IEEE
13 years 11 months ago
2007
IEEE
The ever growing need for improved security, surveillance and identity protection, calls for the creation of evermore reliable and robust face recognition technology that is scala...
VRML
2003
ACM
13 years 10 months ago
2003
ACM
This paper describes a robust mechanism for transmitting 3D meshes over the Internet. TCP/IP is an excellent means for reliable transport over the Internet. However, multi-user, r...
VLSID
2007
IEEE
14 years 5 months ago
2007
IEEE
Interconnect is one of the major concerns in current and future microprocessor designs from both performance and power consumption perspective. The emergence of three-dimensional ...
HPCA
2009
IEEE
14 years 5 months ago
2009
IEEE
Interconnection plays an important role in performance and power of CMP designs using deep sub-micron technology. The network-on-chip (NoCs) has been proposed as a scalable and hi...