26 search results - page 3 / 6 » MCM placement using a realistic thermal model |
ISCAS
1999
IEEE
13 years 10 months ago
1999
IEEE
- Micromachined power sensors with operation up to 50 GHz were recently achieved in CMOS technology [1]. To improve their sensitivity and signal-to-noise ratio, while maintaining m...
NANONET
2009
Springer
13 years 10 months ago
2009
Springer
3D stacked chips have become a promising integration technology for modern systems. The complexity reached in multi-processor systems has increased the communication delays between...
WSCG
2003
13 years 7 months ago
2003
This paper describes a technique for producing realistic animations of melting objects. The work presented here introduces a method that accurately models both thermal flow and t...
DAC
2008
ACM
14 years 7 months ago
2008
ACM
In the design of complex power distribution networks (PDN) with multiple power islands, it is required that the PDN represents a low impedance as seen by the digital modules. This...
GLVLSI
2006
IEEE
14 years 3 days ago
2006
IEEE
Reliability has become a significant challenge for system design in new process technologies. Higher integration levels dramatically increase power densities, which leads to high...