—The very high levels of integration and submicron device sizes used in current and emerging VLSI technologies for FPGAs lead to higher occurrences of defects and operational fau...
This paper presents a novel approach to interconnect fault location for FPGAs during power-on sequence. The method is based on a concept known as fault grading which utilizes defec...
Nicola Campregher, Peter Y. K. Cheung, Milan Vasil...
— To increase the amount of logic available in SRAM-based FPGAs manufacturers are using nanometric technologies to boost logic density and reduce prices. However, nanometric scal...
♦ To increase the amount of logic available to the users in SRAM-based FPGAs, manufacturers are using nanometric technologies to boost logic density and reduce costs, making its ...
This paper presents a revised model for the yield analysis of FPGA interconnect layers. Based on proven yield models, this work improves the predictions and assumptions of previous...
Nicola Campregher, Peter Y. K. Cheung, George A. C...