20 search results - page 1 / 4 » Microarchitectural floorplanning under performance and therm... |
DATE
2006
IEEE
13 years 10 months ago
2006
IEEE
— In this paper, we present the first multi-objective microarchitectural floorplanning algorithm for designing highperformance, high-reliability processors in the early design ...
ASPDAC
2008
ACM
13 years 6 months ago
2008
ACM
Abstract-- In this paper we present the first bus-aware microarchitectural floorplanning. Our goal is to study the impact of bus routability on other important floorplanning object...
ISLPED
2005
ACM
13 years 10 months ago
2005
ACM
Heat is a main concern for processors in deep sub-micron technologies. The chip temperature is affected by both the power consumption of processor components and the chip layout....
ASPDAC
2006
ACM
13 years 10 months ago
2006
ACM
- Although the emerging three-dimensional integration technology can significantly reduce interconnect delay, chip area, and power dissipation in nanometer technologies, its impact...
ASPDAC
2009
ACM
13 years 9 months ago
2009
ACM
—Multi-core microarchitectures require a careful balance between many competing objectives to achieve the highest possible performance. Integrated Early Analysis is the considera...