20 search results - page 3 / 4 » Microarchitectural floorplanning under performance and therm... |
MICRO
2006
IEEE
13 years 11 months ago
2006
IEEE
Power delivery is a growing reliability concern in microprocessors as the industry moves toward feature-rich, powerhungrier designs. To battle the ever-aggravating power consumpti...
DAC
2008
ACM
14 years 6 months ago
2008
ACM
Achieving high performance under a peak temperature limit is a first-order concern for VLSI designers. This paper presents a new model of a thermally-managed system, where a stoch...
MJ
2011
13 years 21 days ago
2011
New tendencies envisage 2D/3D Multi-Processor System-On-Chip (MPSoC) as a promising solution for the consumer electronics market. MPSoCs are complex to design, as they must execute...
ICCAD
2005
IEEE
14 years 2 months ago
2005
IEEE
High power consumption not only leads to short battery life for handheld devices, but also causes on-chip thermal and reliability problems in general. As power consumption is prop...
DAC
2009
ACM
14 years 6 months ago
2009
ACM
Exponentially rising cooling/packaging costs due to high power density call for architectural and software-level thermal management. Dynamic thermal management (DTM) techniques co...