12 search results - page 1 / 3 » Microarchitecture level power and thermal simulation conside... |
ISLPED
2003
ACM
2003
ACM
Microarchitecture level power and thermal simulation considering temperature dependent leakage model
13 years 10 months ago
TCAD
2008
13 years 5 months ago
2008
The nonuniform substrate thermal profile and process variations are two major concerns in the present-day ultradeep submicrometer designs. To correctly predict performance/ leakage...
ISQED
2010
IEEE
14 years 2 days ago
2010
IEEE
Abstract— As the semiconductor technology continues its marching toward the deep sub-micron domain, the strong relation between leakage current and temperature becomes critical i...
DATE
2007
IEEE
13 years 11 months ago
2007
IEEE
Lateral heat conduction between modules affects the temperature profile of a floorplan, affecting the leakage power of individual blocks which increasingly is becoming a larger ...
ICCAD
2006
IEEE
14 years 2 months ago
2006
IEEE
As CMOS technology scales into the nanometer regime, power dissipation and associated thermal concerns in high-performance ICs due to on-chip hot-spots and thermal gradients are b...