Parameter variation due to manufacturing error will be an unavoidable consequence of technology scaling in future generations. The impact of random variation in physical factors s...
Ke Meng, Frank Huebbers, Russ Joseph, Yehea I. Ism...
In this paper, we investigate a new architecture-level thermal characterization problem from behavioral modeling perspective to address the emerging thermal related analysis and o...
⎯ Technology scaling is in the era where the chip performance is constrained by its power dissipation. Although the power limits vary with the application domain, they dictate th...
We present an architectural power simulation technique for PLA-based controllers. The contributions of this work are (1) a simple but ecient power characterization of PLAs; and (2...
Process variations are poised to significantly degrade performance benefits sought by moving to the next nanoscale technology node. Parameter fluctuations in devices can introd...