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» Multilevel global placement with retiming
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ISPD
2006
ACM
102views Hardware» more  ISPD 2006»
13 years 11 months ago
A faster implementation of APlace
APlace is a high quality, scalable analytical placer. This paper describes our recent efforts to improve APlace for speed and scalability. We explore various wirelength and densi...
Andrew B. Kahng, Qinke Wang
DAC
2009
ACM
14 years 5 months ago
Spare-cell-aware multilevel analytical placement
Post-silicon validation has recently drawn designers' attention due to its increasing impacts on the VLSI design cycle and cost. One key feature of the post-silicon validatio...
Zhe-Wei Jiang, Meng-Kai Hsu, Yao-Wen Chang, Kai-Yu...
ASPDAC
2005
ACM
134views Hardware» more  ASPDAC 2005»
13 years 10 months ago
Wire congestion and thermal aware 3D global placement
— The recent popularity of 3D IC technology stems from its enhanced performance capabilities and reduced wirelength. However, wire congestion and thermal issues are exacerbated d...
Karthik Balakrishnan, Vidit Nanda, Siddharth Easwa...
ICCAD
2006
IEEE
129views Hardware» more  ICCAD 2006»
13 years 11 months ago
A high-quality mixed-size analytical placer considering preplaced blocks and density constraints
In addition to wirelength, modern placers need to consider various constraints such as preplaced blocks and density. We propose a high-quality analytical placement algorithm consi...
Tung-Chieh Chen, Zhe-Wei Jiang, Tien-Chang Hsu, Hs...
ASPDAC
2000
ACM
159views Hardware» more  ASPDAC 2000»
13 years 9 months ago
Analytical minimization of half-perimeter wirelength
Global placement of hypergraphs is critical in the top-down placement of large timing-driven designs 10, 16 . Placement quality is evaluated in terms of the half-perimeter wirelen...
Andrew A. Kennings, Igor L. Markov