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ASPDAC
1999
ACM
13 years 9 months ago
1999
ACM
Certain manufacturing steps in very deep submicron VLSI involve chemical-mechanical polishing CMP which has varying e ects on device and interconnect features, depending on loca...
TCAD
2002
13 years 4 months ago
2002
Chemical-mechanical polishing (CMP) and other manufacturing steps in very deep submicron VLSI have varying effects on device and interconnect features, depending on local character...
VLSID
1999
IEEE
13 years 9 months ago
1999
IEEE
To reduce manufacturing variation due to chemicalmechanical polishing and to improve yield, layout must be made uniform with respect to density criteria. This is achieved by layou...
ISPD
2010
ACM
13 years 11 months ago
2010
ACM
In the nanometer IC design, dummy fill is often performed to improve layout pattern uniformity and the post-CMP quality. However, filling dummies might greatly increase intercon...
GECCO
2010
Springer
13 years 6 months ago
2010
Springer
To successfully search multiple coadaptive subcomponents in a solution, we developed a novel cooperative evolutionary algorithm based on a new computational multilevel selection f...