12 search results - page 1 / 3 » New and Exact Filling Algorithms for Layout Density Control |
VLSID
1999
IEEE
13 years 9 months ago
1999
IEEE
To reduce manufacturing variation due to chemicalmechanical polishing and to improve yield, layout must be made uniform with respect to density criteria. This is achieved by layou...
TCAD
2002
13 years 4 months ago
2002
Chemical-mechanical polishing (CMP) and other manufacturing steps in very deep submicron VLSI have varying effects on device and interconnect features, depending on local character...
DAC
2000
ACM
14 years 5 months ago
2000
ACM
We propose practical iterated methods for layout density control for CMP uniformity, based on linear programming, Monte-Carlo and greedy algorithms. We experimentally study the tr...
ASPDAC
1999
ACM
13 years 9 months ago
1999
ACM
Certain manufacturing steps in very deep submicron VLSI involve chemical-mechanical polishing CMP which has varying e ects on device and interconnect features, depending on loca...
TCAD
2002
13 years 4 months ago
2002