The placement of on-die decoupling capacitors (decap) between the power and ground supply grids has become a common practice in high performance processor designs. In this paper, ...
— In three-dimensional (3D) chips, the amount of supply current per package pin is significantly more than in two-dimensional (2D) designs. Therefore, the power supply noise pro...
Pingqiang Zhou, Karthikk Sridharan, Sachin S. Sapa...
One of the fundamental problems in Deep Sub Micron (DSM) circuits is Simultaneous Switching Noise (SSN), which causes voltage fluctuations in the circuit power/ground networks. In...
With increasing aggregate off-chip bandwidths exceeding terabits/second (Tb/s), the power dissipation is a serious design consideration. Additionally, design of I/O links is const...
Hamid Hatamkhani, Frank Lambrecht, Vladimir Stojan...
—Maze routing algorithms are widely used for finding an optimal path in detailed routing for very large scale integration, printed circuit board and multichip modules In this pap...