Variations in delay caused by within-die and die-to-die process variations and SOI history effect increase timing margins and reduce performance. In order to develop mitigation te...
Jim Aarestad, Charles Lamech, Jim Plusquellic, Dhr...
Current Static Timing Analysis (STA) techniques allow one to verify the timing of a circuit at different process corners which only consider cases where all the supplies are low o...
Variations in the semiconductor fabrication process results in variability in parameters between transistors on the same die, a problem exacerbated by lithographic scaling. The re...
In the nanometer manufacturing region, process variation causes significant uncertainty for circuit performance verification. Statistical static timing analysis (SSTA) is thus dev...
There is an increased dominance of intra-die process variations, creating a need for an accurate and fast statistical timing analysis. Most of the recent proposed approaches assum...