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DAC
2011
ACM
12 years 5 months ago
Characterizing within-die and die-to-die delay variations introduced by process variations and SOI history effect
Variations in delay caused by within-die and die-to-die process variations and SOI history effect increase timing margins and reduce performance. In order to develop mitigation te...
Jim Aarestad, Charles Lamech, Jim Plusquellic, Dhr...
DAC
2004
ACM
14 years 6 months ago
Worst-case circuit delay taking into account power supply variations
Current Static Timing Analysis (STA) techniques allow one to verify the timing of a circuit at different process corners which only consider cases where all the supplies are low o...
Dionysios Kouroussis, Rubil Ahmadi, Farid N. Najm
FPGA
2007
ACM
142views FPGA» more  FPGA 2007»
13 years 11 months ago
Parametric yield in FPGAs due to within-die delay variations: a quantitative analysis
Variations in the semiconductor fabrication process results in variability in parameters between transistors on the same die, a problem exacerbated by lithographic scaling. The re...
N. Pete Sedcole, Peter Y. K. Cheung
ASPDAC
2008
ACM
200views Hardware» more  ASPDAC 2008»
13 years 7 months ago
Non-Gaussian statistical timing analysis using second-order polynomial fitting
In the nanometer manufacturing region, process variation causes significant uncertainty for circuit performance verification. Statistical static timing analysis (SSTA) is thus dev...
Lerong Cheng, Jinjun Xiong, Lei He
DAC
2004
ACM
13 years 9 months ago
Statistical gate delay model considering multiple input switching
There is an increased dominance of intra-die process variations, creating a need for an accurate and fast statistical timing analysis. Most of the recent proposed approaches assum...
Aseem Agarwal, Florentin Dartu, David Blaauw