11 search results - page 1 / 3 » Power Reduction of Functional Units Considering Temperature ... |
VLSID
2008
IEEE
14 years 5 months ago
2008
IEEE
Continuous technology scaling has resulted in an increase in both, the power density as well as the variation in device dimensions (process variations) of the manufactured process...
VLSID
2008
IEEE
14 years 5 months ago
2008
IEEE
Technology scaling has resulted in an exponential increase in the leakage power as well as the variations in leakage power of fabricated chips. Functional units (FUs), like Intege...
TCAD
2008
13 years 4 months ago
2008
The nonuniform substrate thermal profile and process variations are two major concerns in the present-day ultradeep submicrometer designs. To correctly predict performance/ leakage...
INTEGRATION
2008
13 years 4 months ago
2008
Thermal gradients across the die are becoming increasingly prominent as we scale further down into the sub-nanometer regime. While temperature was never a primary concern, its non...
EUROSYS
2008
ACM
14 years 1 months ago
2008
ACM
Non-uniform utilization of functional units in combination with hardware mechanisms such as clock gating leads to different power consumptions in different parts of a processor ch...