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MICRO
2008
IEEE
116views Hardware» more  MICRO 2008»
13 years 11 months ago
Power reduction of CMP communication networks via RF-interconnects
As chip multiprocessors scale to a greater number of processing cores, on-chip interconnection networks will experience dramatic increases in both bandwidth demand and power dissi...
M.-C. Frank Chang, Jason Cong, Adam Kaplan, Chunyu...
HPCA
2009
IEEE
14 years 5 months ago
Design and evaluation of a hierarchical on-chip interconnect for next-generation CMPs
Performance and power consumption of an on-chip interconnect that forms the backbone of Chip Multiprocessors (CMPs), are directly influenced by the underlying network topology. Bo...
Reetuparna Das, Soumya Eachempati, Asit K. Mishra,...
GLVLSI
2009
IEEE
262views VLSI» more  GLVLSI 2009»
13 years 2 months ago
Power distribution paths in 3-D ICS
Distributing power and ground to a vertically integrated system is a complex and difficult task. Interplane communication and power delivery are achieved by through silicon vias (...
Vasilis F. Pavlidis, Giovanni De Micheli
CASES
2006
ACM
13 years 11 months ago
High-level power analysis for multi-core chips
Technology trends have led to the advent of multi-core chips in the form of both general-purpose chip multiprocessors (CMPs) and embedded multi-processor systems-on-a-chip (MPSoCs...
Noel Eisley, Vassos Soteriou, Li-Shiuan Peh
DSN
2007
IEEE
13 years 11 months ago
Utilizing Dynamically Coupled Cores to Form a Resilient Chip Multiprocessor
Aggressive CMOS scaling will make future chip multiprocessors (CMPs) increasingly susceptible to transient faults, hard errors, manufacturing defects, and process variations. Exis...
Christopher LaFrieda, Engin Ipek, José F. M...