232 search results - page 2 / 47 » Practical aspects of reliability analysis for IC designs |
MR
2007
13 years 5 months ago
2007
Due to the miniaturization of integrated circuits, their thermo-mechanical reliability tends to become a truly critical design criterion.
IC3
2009
13 years 3 months ago
2009
In this paper we have worked out on some the complex modeling aspects such as Multi Scale modeling, MATLAB Sugar based modeling and have shown the complexities involved in the anal...
GLVLSI
2005
IEEE
13 years 11 months ago
2005
IEEE
A hierarchical scheme with cells and modules is crucial for managing design complexity during a large integrated circuit design. We present a methodology for thermal aware cell-ba...
ICCAD
2006
IEEE
14 years 2 months ago
2006
IEEE
Abstract— Chip-package thermal analysis is necessary for the design and synthesis of reliable, high-performance, low-power, compact integrated circuits (ICs). Many methods of IC ...
EURODAC
1995
IEEE
13 years 9 months ago
1995
IEEE
A three level software system for thermal analysis of semiconductor devices, one-chip monolith IC's, multi-chip modules (MCM) and hybrid IC's is presented. For each desig...