3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
During recent years, microprocessor energy consumption has been surging and efforts to reduce power and energy have received a lot of attention. At the same time, virtual executio...
Process variations are poised to significantly degrade performance benefits sought by moving to the next nanoscale technology node. Parameter fluctuations in devices can introd...
The emergence of power as a first-class design constraint has fueled the proposal of a growing number of run-time power optimizations. Many of these optimizations trade-off power...
As technology scaling drives the number of processor cores upward, current on-chip routers consume substantial portions of chip area and power budgets. Since existing research has...
Mitchell Hayenga, Natalie D. Enright Jerger, Mikko...