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CODES
2007
IEEE
13 years 11 months ago
Three-dimensional multiprocessor system-on-chip thermal optimization
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
Chong Sun, Li Shang, Robert P. Dick
VEE
2006
ACM
178views Virtualization» more  VEE 2006»
13 years 11 months ago
Impact of virtual execution environments on processor energy consumption and hardware adaptation
During recent years, microprocessor energy consumption has been surging and efforts to reduce power and energy have received a lot of attention. At the same time, virtual executio...
Shiwen Hu, Lizy Kurian John
ISCA
2008
IEEE
135views Hardware» more  ISCA 2008»
13 years 11 months ago
ReVIVaL: A Variation-Tolerant Architecture Using Voltage Interpolation and Variable Latency
Process variations are poised to significantly degrade performance benefits sought by moving to the next nanoscale technology node. Parameter fluctuations in devices can introd...
Xiaoyao Liang, Gu-Yeon Wei, David Brooks
IEEEPACT
2008
IEEE
13 years 11 months ago
Multi-optimization power management for chip multiprocessors
The emergence of power as a first-class design constraint has fueled the proposal of a growing number of run-time power optimizations. Many of these optimizations trade-off power...
Ke Meng, Russ Joseph, Robert P. Dick, Li Shang
MICRO
2009
IEEE
120views Hardware» more  MICRO 2009»
13 years 12 months ago
SCARAB: a single cycle adaptive routing and bufferless network
As technology scaling drives the number of processor cores upward, current on-chip routers consume substantial portions of chip area and power budgets. Since existing research has...
Mitchell Hayenga, Natalie D. Enright Jerger, Mikko...