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DAC
2002
ACM
14 years 6 months ago
A physical model for the transient response of capacitively loaded distributed rlc interconnects
Rapid approximation of the transient response of high-speed global interconnects is needed to estimate the time delay, crosstalk, and overshoot in a GSI multilevel wiring network....
Raguraman Venkatesan, Jeffrey A. Davis, James D. M...
ISLPED
2005
ACM
99views Hardware» more  ISLPED 2005»
13 years 11 months ago
A low-power bus design using joint repeater insertion and coding
In this paper, we propose joint repeater insertion and crosstalk avoidance coding as a low-power alternative to repeater insertion for global bus design in nanometer technologies....
Srinivasa R. Sridhara, Naresh R. Shanbhag
ASPDAC
2009
ACM
145views Hardware» more  ASPDAC 2009»
13 years 11 months ago
High performance on-chip differential signaling using passive compensation for global communication
— To address the performance limitation brought by the scaling issues of on-chip global wires, a new configuration for global wiring using on-chip lossy transmission lines is pr...
Ling Zhang, Yulei Zhang, Akira Tsuchiya, Masanori ...
ISLPED
2005
ACM
108views Hardware» more  ISLPED 2005»
13 years 11 months ago
Replacing global wires with an on-chip network: a power analysis
This paper explores the power implications of replacing global chip wires with an on-chip network. We optimize network links by varying repeater spacing, link pipelining, and volt...
Seongmoo Heo, Krste Asanovic
ICCD
2008
IEEE
175views Hardware» more  ICCD 2008»
14 years 2 months ago
On-chip high performance signaling using passive compensation
— To address the performance limitation brought by the scaling issues of on-chip global wires, a new configuration for global wiring using on-chip lossy transmission lines(T-lin...
Yulei Zhang, Ling Zhang, Akira Tsuchiya, Masanori ...