The Y-architecture for on-chip interconnect is based on pervasive use of 0-, 120-, and 240-degree oriented semi-global and global wiring. Its use of three uniform directions explo...
Hongyu Chen, Chung-Kuan Cheng, Andrew B. Kahng, Io...
This paper explores the power implications of replacing global chip wires with an on-chip network. We optimize network links by varying repeater spacing, link pipelining, and volt...
As packet-switching interconnection networks replace buses and dedicated wires to become the standard on-chip interconnection fabric, reducing their power consumption has been ide...
On-chip interconnection networks (OCINs) have emerged as a modular and scalable solution for wire delay constraints in deep submicron VLSI design. OCIN research has shown that the ...
Avinash Karanth Kodi, Ashwini Sarathy, Ahmed Louri
Different interconnection structures have been proposed to solve the performance limitation caused by scaling of on-chip global wires. In this paper, we give an overview of curre...
Yulei Zhang, Xiang Hu, Alina Deutsch, A. Ege Engin...