We present simulations for ultra-thin body, fully-depleted, double-gate (DG) silicon-on-insulator (SOI) devices that can be readily optimized for both static power loss and perfor...
We fabricated a 3D-integrated multi-chip sensor separate dies [9]. In this paper, we present a 3D integrated and actuator and demonstrated the ability of communication with tempera...
This paper describes a family of high-speed Finite Impulse Response (FIR) digital filters that have been scaled across three generations of CMOS processes. The processes include c...
Lars E. Thon, Ghavam G. Shahidi, Werner Rausch, Ge...