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    » Simulation analysis of cluster tool operations in wafer fabr...
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    WSC
    2007
    150views Modeling And Simulation» more  WSC 2007»
    Sensitivity analysis on causal events of WIP bubbles by a log-driven simulator
    13 years 7 months ago
    Sensitivity analysis on causal events of WIP bubbles by a log-driven simulator
    Download  www.informs-sim.org
    Fluctuations of work-in-progress (WIP) levels cause variability of cycle time and often lead to productivity losses in semiconductor wafer fabrication plants. To identify sources ...
    Ryo Hirade, Rudy Raymond, Hiroyuki Okano
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    WSC
    1998
    90views Modeling And Simulation» more  WSC 1998»
    A Rapid Modeling Technique for Measurable Improvements in Factory Performance
    13 years 6 months ago
    A Rapid Modeling Technique for Measurable Improvements in Factory Performance
    Download  www.informs-sim.org
    This paper discusses a methodology for quickly investigating problem areas in semiconductor wafer fabrication factories by creating a model for the production area of interest onl...
    Andreas Peikert, Josef Thoma, Steven Brown
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    WSC
    2004
    130views Modeling And Simulation» more  WSC 2004»
    Comparative Factory Analysis of Standard FOUP Capacities
    13 years 6 months ago
    Comparative Factory Analysis of Standard FOUP Capacities
    Download  www.informs-sim.org
    Wafers in a 300-mm semiconductor fabrication facility are transported throughout the factory in carriers called front opening unified pods (FOUPs). Two standard capacities of FOUP...
    Kranthi Mitra Adusumilli, Robert L. Wright
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    WSC
    2000
    141views Modeling And Simulation» more  WSC 2000»
    Understanding the impact of equipment and process changes with a heterogeneous semiconductor manufacturing simulation environmen
    13 years 6 months ago
    Understanding the impact of equipment and process changes with a heterogeneous semiconductor manufacturing simulation environmen
    Download  www.isr.umd.edu
    Simulation models are useful to predict and understand the impact of changes to a manufacturing system. Typical factory simulation models include the parts being manufactured in t...
    Jeffrey W. Herrmann, Brian F. Conaghan, Laurent He...
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    ATS
    2003
    IEEE
    126views Hardware» more  ATS 2003»
    Analyzing the Impact of Process Variations on DRAM Testing Using Border Resistance Traces
    13 years 10 months ago
    Analyzing the Impact of Process Variations on DRAM Testing Using Border Resistance Traces
    Download  ce.et.tudelft.nl
    Abstract: As a result of variations in the fabrication process, different memory components are produced with different operational characteristics, a situation that complicates th...
    Zaid Al-Ars, A. J. van de Goor
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