— Sub-micron feature sizes have resulted in a considerable portion of power to be dissipated on the buses, causing an increased attention on savings for power at the behavioral l...
Three-dimensional integrated circuits (3D-ICs) are a promising approach to address the integration challenges faced by current systems on chips (SoCs). Designing an efficient netwo...
Lowering down the chip temperature is becoming one of the important design considerations, since temperature adversely and seriously affects many of design qualities, such as reli...
This paper presents a comprehensive timing model for behavioral-level specifications and algorithms for timing analysis in high-level synthesis. It is based on a timing network wh...
This paper describes an implementation language and synthesis system for automatically generating latency insensitive synchronous digital designs. These designs decouple behaviora...