25 search results - page 2 / 5 » Temperature Aware Scheduling for Embedded Processors |
TPDS
2010
13 years 3 months ago
2010
Abstract—A rising horizon in chip fabrication is the 3D integration technology. It stacks two or more dies vertically with a dense, highspeed interface to increase the device den...
DAC
2009
ACM
14 years 3 days ago
2009
ACM
With new technologies, temperature has become a major issue to be considered at system level design. Without taking temperature aspects into consideration, no approach to energy o...
ISLPED
2009
ACM
13 years 10 months ago
2009
ACM
In this paper, we propose a proactive dynamic thermal management scheme for chip multiprocessors that run multi-threaded workloads. We introduce a new predictor that utilizes the ...
DAGSTUHL
2006
13 years 6 months ago
2006
Long-term reliability of processors in embedded systems is experiencing growing attention since decreasing feature sizes and increasing power consumption have a negative influence...
ISLPED
2010
ACM
13 years 5 months ago
2010
ACM
The ongoing scaling of semiconductor technology is causing severe increase of on-chip power density and temperature in microprocessors. This has raised urgent requirement for both...