30 search results - page 4 / 6 » Temperature- and Cost-Aware Design of 3D Multiprocessor Arch... |
ASPLOS
2006
ACM
13 years 11 months ago
2006
ACM
While the number of transistors on a chip increases exponentially over time, the productivity that can be realized from these systems has not kept pace. To deal with the complexit...
DAC
2009
ACM
14 years 6 months ago
2009
ACM
Three-dimensional integrated circuits (3D ICs) offer a promising solution to overcome the on-chip communication bottleneck and improve performance over traditional two-dimensional...
DAC
2008
ACM
14 years 6 months ago
2008
ACM
In deep submicron circuits, thermal hot spots and high temperature gradients increase the cooling costs, and degrade reliability and performance. In this paper, we propose a low-co...
DAC
2007
ACM
14 years 6 months ago
2007
ACM
Three-Dimensional integration provides a simultaneous improvement in wire-related delay and power consumption of microprocessor circuits. Prior work has looked at the performance,...
DAC
2000
ACM
14 years 6 months ago
2000
ACM
Continuous scaling of VLSI circuits is reducing gate delays but rapidly increasing interconnect delays. Semiconductor Industry Association (SIA) roadmap predicts that, beyond the ...