Power density has been increasing at an alarming rate in recent processor generations resulting in high on-chip temperature. Higher temperature results in poor reliability and inc...
—Increasing integrated circuit (IC) power densities and temperatures may hamper multiprocessor system-on-chip (MPSoC) use in hard real-time systems. This article formalizes the t...
Thidapat Chantem, Robert P. Dick, Xiaobo Sharon Hu
Thermal hot spots and high temperature gradients degrade reliability and performance, and increase cooling costs and leakage power. In this paper, we explore the benefits of temper...
Ayse Kivilcim Coskun, T. T. Rosing, Keith Whisnant...
With the shrinking of technology feature sizes, the share of leakage in total power consumption of digital systems continues to grow. Traditional dynamic voltage scaling (DVS) fail...
In deep submicron circuits, elevation in temperatures has brought new challenges in reliability, timing, performance, cooling costs and leakage power. Conventional thermal managem...