7 search results - page 1 / 2 » Thermal analysis of a 3D die-stacked high-performance microp... |
MICRO
2006
IEEE
13 years 11 months ago
2006
IEEE
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
ICCD
2004
IEEE
14 years 2 months ago
2004
IEEE
This short paper explores an implementation of a new technology called 3D die stacking and describes research activity at Intel. 3D die stacking is the bonding of two die either f...
GLVLSI
2006
IEEE
13 years 11 months ago
2006
IEEE
3-dimensional integrated circuit (3D IC) technology places circuit blocks in the vertical dimension in addition to the conventional horizontal plane. Compared to conventional plan...
DAC
2007
ACM
14 years 6 months ago
2007
ACM
Three-Dimensional integration provides a simultaneous improvement in wire-related delay and power consumption of microprocessor circuits. Prior work has looked at the performance,...
DAC
2006
ACM
14 years 6 months ago
2006
ACM
Modern high performance processors employ advanced techniques for thermal management, which rely on accurate readings of on-die thermal sensors. As the importance of thermal effec...