1635 search results - page 2 / 327 » Thermally Aware Design |
VLSID
2010
IEEE
13 years 9 months ago
2010
IEEE
Network-on-Chip combined with Globally Asynchronous Locally Synchronous paradigm is a promising architecture for easy IP integration and utilization with multiple voltage levels. ...
ICCD
2005
IEEE
14 years 2 months ago
2005
IEEE
As CMOS technology scales deeper into the nanometer regime, factors such as leakage power and chip temperature emerge as critically important concerns for VLSI design. This paper,...
ISCA
2003
IEEE
13 years 10 months ago
2003
IEEE
With power density and hence cooling costs rising exponentially, processor packaging can no longer be designed for the worst case, and there is an urgent need for runtime processo...
DAC
2009
ACM
14 years 3 days ago
2009
ACM
With new technologies, temperature has become a major issue to be considered at system level design. Without taking temperature aspects into consideration, no approach to energy o...
ISVLSI
2006
IEEE
13 years 11 months ago
2006
IEEE
Thermal management is becoming increasingly important in circuit designs with high power density. Circuits that overheat beyond specified operating conditions may suffer timing f...