17 search results - page 1 / 4 » Three Dimensional VLSI-Scale Interconnects |
NANONET
2009
Springer
14 years 16 hour ago
2009
Springer
A new approach for inserting repeaters in 3-D interconnects is proposed. The allocation of repeaters along an interplane interconnect is iteratively determined. The proposed approa...
IPPS
2000
IEEE
13 years 10 months ago
2000
IEEE
As processor speeds rapidly approach the Giga-Hertz regime, the disparity between process time and memory access time plays an increasing role in the overall limitation of processo...
TPDS
1998
13 years 5 months ago
1998
—Three-dimensional packaging technologies are critical for enabling ultra-compact, massively parallel processors (MPPs) for embedded applications. Through-wafer optical interconn...
ASPDAC
2009
ACM
13 years 6 months ago
2009
ACM
- As technology scales, interconnect delays begin to dominate the performance of modern microprocessors. The ability to reduce the length of global wires has become an important de...
ICCSA
2003
Springer
13 years 10 months ago
2003
Springer
The finite difference discretization of the Poisson equation in three dimensions results in a large, sparse, and highly structured system of linear equations. This prototype prob...