1476 search results - page 1 / 296 » Three-dimensional integrated circuits |
ISQED
2002
IEEE
13 years 9 months ago
2002
IEEE
In this paper, we describe a comprehensive layout methodology for bonded three-dimensional integrated circuits (3D ICs). In bonded 3D integration technology, parts of a circuit ar...
10
Voted
ISVLSI
2003
IEEE
13 years 10 months ago
2003
IEEE
Three-dimensional integration technologies have been proposed in order to mitigate design challenges posed by deep-submicron interconnect. By providing multiple layers of active d...
NANONET
2009
Springer
13 years 11 months ago
2009
Springer
A new approach for inserting repeaters in 3-D interconnects is proposed. The allocation of repeaters along an interplane interconnect is iteratively determined. The proposed approa...
ISCAS
1995
IEEE
13 years 8 months ago
1995
IEEE
ICCD
2005
IEEE
14 years 1 months ago
2005
IEEE
As technology scales, interconnects dominate the performance and power behavior of deep submicron designs. Three-dimensional integrated circuits (3D ICs) have been proposed as a w...